t-Global Technology - TG2030-19.50-12.70-3

KEY Part #: K6153148

TG2030-19.50-12.70-3 Prezos (USD) [115457unidades de stock]

  • 1 pcs$0.32036
  • 10 pcs$0.30454
  • 25 pcs$0.28919
  • 50 pcs$0.28152
  • 100 pcs$0.27776
  • 250 pcs$0.25872
  • 500 pcs$0.24350
  • 1,000 pcs$0.22067
  • 5,000 pcs$0.21306

Número de peza:
TG2030-19.50-12.70-3
Fabricante:
t-Global Technology
Descrición detallada:
THERM PAD 19.50MMX12.7MM WHITE.
Prazo de entrega estándar do fabricante:
En stock
Vida útil:
Un ano
Chip De:
Hong Kong
RoHS:
Forma de pago:
Forma de envío:
Categorías familiares:
KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Térmico: adhesivos, epoxi, graxas, pastas, Pías térmicas, Conxuntos térmicos - termoeléctricos, de peltier, Módulos termoeléctricos, de peltier, Térmico: accesorios, Fans de CA, Térmicas: almofadas, follas and Aficionados - Accesorios ...
Ventaxa competitiva:
We specialize in t-Global Technology TG2030-19.50-12.70-3 electronic components. TG2030-19.50-12.70-3 can be shipped within 24 hours after order. If you have any demands for TG2030-19.50-12.70-3, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TG2030-19.50-12.70-3 Atributos do produto

Número de peza : TG2030-19.50-12.70-3
Fabricante : t-Global Technology
Descrición : THERM PAD 19.50MMX12.7MM WHITE
Serie : TG2030
Estado da parte : Active
Uso : -
Tipo : Conductive Pad, Sheet
Forma : Rectangular
Esquema : 19.50mm x 12.70mm
Grosor : 0.118" (3.00mm)
Material : Silicone Elastomer
Adhesivo : Tacky - Both Sides
Backing, transportista : -
Cor : White
Resistividade térmica : -
Condutividade térmica : 2.0 W/m-K

Tamén pode estar interesado
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole