Bergquist - HF115AC-0.0055-AC-90

KEY Part #: K6153326

HF115AC-0.0055-AC-90 Prezos (USD) [935213unidades de stock]

  • 1 pcs$0.03955
  • 10 pcs$0.03441
  • 50 pcs$0.03085
  • 100 pcs$0.02729
  • 500 pcs$0.02373
  • 1,000 pcs$0.01780
  • 5,000 pcs$0.01542

Número de peza:
HF115AC-0.0055-AC-90
Fabricante:
Bergquist
Descrición detallada:
THERM PAD 21.84MMX18.79MM W/ADH.
Prazo de entrega estándar do fabricante:
En stock
Vida útil:
Un ano
Chip De:
Hong Kong
RoHS:
Forma de pago:
Forma de envío:
Categorías familiares:
KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Térmicas: almofadas, follas, Fans de CA, Térmico: accesorios, Térmico: adhesivos, epoxi, graxas, pastas, Conxuntos térmicos - termoeléctricos, de peltier, Módulos termoeléctricos, de peltier, Refrigeración térmica - líquida and Térmico: adhesivos, epoxi, graxas, pastas ...
Ventaxa competitiva:
We specialize in Bergquist HF115AC-0.0055-AC-90 electronic components. HF115AC-0.0055-AC-90 can be shipped within 24 hours after order. If you have any demands for HF115AC-0.0055-AC-90, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HF115AC-0.0055-AC-90 Atributos do produto

Número de peza : HF115AC-0.0055-AC-90
Fabricante : Bergquist
Descrición : THERM PAD 21.84MMX18.79MM W/ADH
Serie : Hi-Flow® 115-AC
Estado da parte : Active
Uso : TO-218, TO-220, TO-247
Tipo : Pad, Sheet
Forma : Rectangular
Esquema : 21.84mm x 18.79mm
Grosor : 0.0055" (0.140mm)
Material : Phase Change Compound
Adhesivo : Adhesive - One Side
Backing, transportista : Fiberglass
Cor : Gray
Resistividade térmica : 0.35°C/W
Condutividade térmica : 0.8 W/m-K

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