BDN18-3CB/A01 Prezos (USD) [25551unidades de stock]
- 1 pcs$1.76721
- 10 pcs$1.72093
- 25 pcs$1.67431
- 50 pcs$1.58123
- 100 pcs$1.48820
- 250 pcs$1.39520
- 500 pcs$1.34870
- 1,000 pcs$1.20918
- Número de peza:
- BDN18-3CB/A01
- Fabricante:
- CTS Thermal Management Products
- Descrición detallada:
- HEATSINK CPU W/ADHESIVE 1.81SQ.
- Prazo de entrega estándar do fabricante:
- En stock
- Vida útil:
- Un ano
- Chip De:
- Hong Kong
- RoHS:
- Forma de pago:
-
- Forma de envío:
- Categorías familiares:
- KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Aficionados - Accesorios, Térmico: adhesivos, epoxi, graxas, pastas, Térmicas: almofadas, follas, Módulos termoeléctricos, de peltier, Fans de CA, Fans DC, Ventiladores - Accesorios - Cordóns do ventilador and Pías térmicas ...
- Ventaxa competitiva:
- We specialize in CTS Thermal Management Products BDN18-3CB/A01 electronic components. BDN18-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN18-3CB/A01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN18-3CB/A01 Atributos do produto
Número de peza :
BDN18-3CB/A01
Fabricante :
CTS Thermal Management Products
Descrición :
HEATSINK CPU W/ADHESIVE 1.81SQ
Serie :
BDN
Estado da parte :
Active
Tipo :
Top Mount
Refrixeración do paquete :
Assorted (BGA, LGA, CPU, ASIC...)
Método de anexo :
Thermal Tape, Adhesive (Included)
Forma :
Square, Pin Fins
Lonxitude :
1.810" (45.97mm)
Ancho :
1.810" (45.97mm)
Diámetro :
-
Altura fóra de base (altura de aleta) :
0.355" (9.02mm)
Disipación de potencia @ aumento da temperatura :
-
Resistencia térmica @ Fluxo de aire forzado :
3.50°C/W @ 400 LFM
Resistencia Térmica @ Natural :
10.80°C/W
Material :
Aluminum
Acabado de material :
Black Anodized
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