Bergquist - HF115AC-0.0055-AC-58

KEY Part #: K6152964

HF115AC-0.0055-AC-58 Prezos (USD) [935213unidades de stock]

  • 1 pcs$0.03955
  • 10 pcs$0.03362
  • 50 pcs$0.03022
  • 100 pcs$0.02674
  • 500 pcs$0.02326
  • 1,000 pcs$0.01744
  • 5,000 pcs$0.01512

Número de peza:
HF115AC-0.0055-AC-58
Fabricante:
Bergquist
Descrición detallada:
THERM PAD 19.05MMX12.7MM W/ADH.
Prazo de entrega estándar do fabricante:
En stock
Vida útil:
Un ano
Chip De:
Hong Kong
RoHS:
Forma de pago:
Forma de envío:
Categorías familiares:
KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Fans DC, Módulos termoeléctricos, de peltier, Aficionados - Accesorios, Térmico: adhesivos, epoxi, graxas, pastas, Conxuntos térmicos - termoeléctricos, de peltier, Ventiladores - Accesorios - Cordóns do ventilador, Térmico: accesorios and Fans de CA ...
Ventaxa competitiva:
We specialize in Bergquist HF115AC-0.0055-AC-58 electronic components. HF115AC-0.0055-AC-58 can be shipped within 24 hours after order. If you have any demands for HF115AC-0.0055-AC-58, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HF115AC-0.0055-AC-58 Atributos do produto

Número de peza : HF115AC-0.0055-AC-58
Fabricante : Bergquist
Descrición : THERM PAD 19.05MMX12.7MM W/ADH
Serie : Hi-Flow® 115-AC
Estado da parte : Active
Uso : TO-220
Tipo : Pad, Sheet
Forma : Rectangular
Esquema : 19.05mm x 12.70mm
Grosor : 0.0055" (0.140mm)
Material : Phase Change Compound
Adhesivo : Adhesive - One Side
Backing, transportista : Fiberglass
Cor : Gray
Resistividade térmica : 0.35°C/W
Condutividade térmica : 0.8 W/m-K

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