4636 Prezos (USD) [584508unidades de stock]
- 1 pcs$0.07514
- 10 pcs$0.07119
- 50 pcs$0.04540
- 100 pcs$0.04386
- 250 pcs$0.03783
- 500 pcs$0.03777
- 1,000 pcs$0.03177
- 2,500 pcs$0.02874
- 5,000 pcs$0.02723
- Número de peza:
- 4636
- Fabricante:
- Keystone Electronics
- Descrición detallada:
- THERM PAD 42.04MMX27MM. Mounting Hardware TO3 MICA INSULATOR
- Prazo de entrega estándar do fabricante:
- En stock
- Vida útil:
- Un ano
- Chip De:
- Hong Kong
- RoHS:
- Forma de pago:
-
- Forma de envío:
- Categorías familiares:
- KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Pías térmicas, Térmico: adhesivos, epoxi, graxas, pastas, Ventiladores - Accesorios - Cordóns do ventilador, Térmico: adhesivos, epoxi, graxas, pastas, Fans de CA, Aficionados - Accesorios, Fans DC and Módulos termoeléctricos, de peltier ...
- Ventaxa competitiva:
- We specialize in Keystone Electronics 4636 electronic components. 4636 can be shipped within 24 hours after order. If you have any demands for 4636, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
4636 Atributos do produto
Número de peza :
4636
Fabricante :
Keystone Electronics
Descrición :
THERM PAD 42.04MMX27MM
Serie :
-
Estado da parte :
Active
Uso :
TO-3
Tipo :
Die-Cut Pad, Sheet
Forma :
Rhombus
Esquema :
42.04mm x 27.00mm
Grosor :
0.0030" (0.076mm)
Material :
Mica
Adhesivo :
-
Backing, transportista :
-
Cor :
-
Resistividade térmica :
-
Condutividade térmica :
-
Últimas novas
Tamén pode estar interesado
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-264
Wakefield-Vette
THERM PAD 26.67MMX21.59MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-264 Pad, 0.003 Inch Thick
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Pezas quentes
- A14563-02
- A14573-01
- A14950-17
- GPHC3.0-0.100-02-0816
- A14568-01
- A14950-10
- A14950-08
- A14950-05
- GP3500ULM--0.020-12-0816
- A14950-03
- T69-295-295-0.040-1A
- 5519S 210 MM X 155 MM X 1.0 MM
- A14162-26
- DC0040/03-PC99-0.06
- DC0040/11-PC99AL-0.1
- DC0038/02-PC99-0.06
- DC0037/03-PC99AL-0.1
- DC0037/01-PC99-0.06
- DC0036/04-PC99-0.06
- DC0038/02-PC99AL-0.1
- DC0041/04-PC99AL-0.1
- DC0038/04-PC99-0.06
- TG4040S-320-320-3.0-0
- TG4040S-150-150-2.0-0
- TG4040S-100-100-3.0-0
- TG4040S-300-300-5.0-0
- PC93-150-150-0.25-0
- PC99-300-300-0.06-0
- A15673-08
- A16364-07
- A15641-15
- A14162-27
- 5591S 210 MM X 300 MM 2.0 MM
- CPU 1.375X1.375
- DC0040/09-PC99AL-0.1
- DC0040/05-PC99-0.06
- GPVOU-0.100-01-0816
- SPK10-0.006-00-48
- SP400-0.009-00-22
- Q3-0.005-00-11