Advanced Thermal Solutions Inc. - ATS-P1-22-C2-R0

KEY Part #: K6263902

ATS-P1-22-C2-R0 Prezos (USD) [11432unidades de stock]

  • 1 pcs$3.38458
  • 10 pcs$3.29291
  • 25 pcs$3.10993
  • 50 pcs$2.92704
  • 100 pcs$2.74411
  • 250 pcs$2.56115
  • 500 pcs$2.37821
  • 1,000 pcs$2.33247

Número de peza:
ATS-P1-22-C2-R0
Fabricante:
Advanced Thermal Solutions Inc.
Descrición detallada:
HEATSINK 60X60X12.7MM XCUT T766.
Prazo de entrega estándar do fabricante:
En stock
Vida útil:
Un ano
Chip De:
Hong Kong
RoHS:
Forma de pago:
Forma de envío:
Categorías familiares:
KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Conxuntos térmicos - termoeléctricos, de peltier, Térmico: adhesivos, epoxi, graxas, pastas, Fans de CA, Fans DC, Módulos termoeléctricos, de peltier, Térmico: adhesivos, epoxi, graxas, pastas, Aficionados - Accesorios and Pías térmicas ...
Ventaxa competitiva:
We specialize in Advanced Thermal Solutions Inc. ATS-P1-22-C2-R0 electronic components. ATS-P1-22-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-P1-22-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-P1-22-C2-R0 Atributos do produto

Número de peza : ATS-P1-22-C2-R0
Fabricante : Advanced Thermal Solutions Inc.
Descrición : HEATSINK 60X60X12.7MM XCUT T766
Serie : pushPIN™
Estado da parte : Active
Tipo : Top Mount
Refrixeración do paquete : Assorted (BGA, LGA, CPU, ASIC...)
Método de anexo : Push Pin
Forma : Square, Fins
Lonxitude : 2.362" (60.00mm)
Ancho : 2.362" (60.00mm)
Diámetro : -
Altura fóra de base (altura de aleta) : 0.500" (12.70mm)
Disipación de potencia @ aumento da temperatura : -
Resistencia térmica @ Fluxo de aire forzado : 13.83°C/W @ 100 LFM
Resistencia Térmica @ Natural : -
Material : Aluminum
Acabado de material : Blue Anodized

Tamén pode estar interesado
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.