[22853unidades de stock]
- Número de peza:
- KLM8G1GESD-B03P
- Fabricante:
- Samsung Semiconductor
- Descrición detallada:
- eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.
- Prazo de entrega estándar do fabricante:
- En stock
- Vida útil:
- Un ano
- Chip De:
- Hong Kong
- RoHS:
- Forma de pago:
-
- Forma de envío:
- Categorías familiares:
- KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: GDDR5, SLC Nand, HBM Flarebolt, LPDDR4, HBM Aquabolt, DDR4, LPDDR5 and MODULE ...
- Ventaxa competitiva:
- We specialize in Samsung Semiconductor KLM8G1GESD-B03P electronic components. KLM8G1GESD-B03P can be shipped within 24 hours after order. If you have any demands for KLM8G1GESD-B03P, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
KLM8G1GESD-B03P Atributos do produto
Número de peza :
KLM8G1GESD-B03P
Fabricante :
Samsung Semiconductor
Descrición :
eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production
Serie :
DDR3
versión :
eMMC 5.0
densidade :
8 GB
Voltaxe :
1.8 / 3.3 V
interface :
HS400
Tamaño do paquete :
11.5 x 13 x 0.8 mm
Temp. :
-40 ~ 85 °C
estado do produto :
Mass Production
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