Samsung Semiconductor, Inc. - SIP-ASRNXS002

KEY Part #: K7346477

SIP-ASRNXS002 Prezos (USD) [410unidades de stock]

1 pcs$123.99174
10 pcs$121.19250
25 pcs$116.53135

Número de peza:: SIP-ASRNXS002

Fabricante:: Samsung Semiconductor, Inc.

Descrición detallada:: 5 INCH MIPI LCD.

Prazo de entrega estándar do fabricante:: En stock

Vida útil:: Un ano

Chip De:: Hong Kong

RoHS:

Forma de pago:

Forma de envío:

Categorías familiares:: KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: Cadros de avaliación: controladores LED, Cadros de avaliación: convertedores dixitais a ana, Programadores, emuladores e depuradores, Cadros de avaliación - Reguladores de tensión line, Cadros de avaliación: conversores analóxicos a dix, Cadros de avaliación: incrustados - MCU, DSP, Cadros de avaliación: incrustados - Lóxica complex and Adaptadores de programación, zócalos ...

Ventaxa competitiva:: We specialize in Samsung Semiconductor, Inc. SIP-ASRNXS002 electronic components. SIP-ASRNXS002 can be shipped within 24 hours after order. If you have any demands for SIP-ASRNXS002, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

GB-T-27922

ISO-9001-2015

ISO-13485

ISO-14001

ISO-28000-2007

ISO-45001-2018

SIP-ASRNXS002 Atributos do produto

Número de peza : SIP-ASRNXS002

Fabricante : Samsung Semiconductor, Inc.

Descrición : 5 INCH MIPI LCD

Serie : ARTIK

Estado da parte : Active

Plataforma : ARTIK

Tipo : Display

Función : LCD Touchscreen 5"

IC / Parte empregada : mXT540S

Contidos : Board(s)

Últimas novas

Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology

Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones

Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor

Bringing Artificial Intelligence to Devices Everywhere

The future of NAND technology

Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology

Inside the building blocks of the 5G future

Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards

[Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions

Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI

Evolving Mobile Solutions: Samsung at MWC 2018

Samsung Enhances Functional Safety to its Automotive Semiconductors with ISO 26262 Certification

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