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  5. K4F8E3S4HD-GUCL

Samsung Semiconductor - K4F8E3S4HD-GUCL

KEY Part #: K7359773

[22586unidades de stock]

    Número de peza:
    K4F8E3S4HD-GUCL
    Fabricante:
    Samsung Semiconductor
    Descrición detallada:
    8 Gb x32 4266 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 125 °C 200FBGA Mass Production.
    Prazo de entrega estándar do fabricante:
    En stock
    Vida útil:
    Un ano
    Chip De:
    Hong Kong
    RoHS:
    Forma de pago:
    Forma de envío:
    Categorías familiares:
    KEY Components Co, LTD é un distribuidor de compoñentes electrónicos que ofrece categorías de produtos, incluíndo: LPDDR3, HBM Aquabolt, GDDR6, DDR4, GDDR5, LPDDR5, LPDDR4X and DDR3 ...
    Ventaxa competitiva:
    We specialize in Samsung Semiconductor K4F8E3S4HD-GUCL electronic components. K4F8E3S4HD-GUCL can be shipped within 24 hours after order. If you have any demands for K4F8E3S4HD-GUCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4F8E3S4HD-GUCL Atributos do produto

    Número de peza : K4F8E3S4HD-GUCL
    Fabricante : Samsung Semiconductor
    Descrición : 8 Gb x32 4266 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 125 °C 200FBGA Mass Production
    Serie : DDR3
    densidade : 8 Gb
    Org. : x32
    velocidade : 4266 Mbps
    Voltaxe : 1.8 / 1.1 / 1.1 V
    Temp. : -40 ~ 125 °C
    paquete : 200FBGA
    estado do produto : Mass Production

    Últimas novas

    Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    Samsung Launches Industry’s First 12Gb LPDDR4 DRAM
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Mass Production of Fifth-Generation V-NAND has Started
    Samsung Electronics Takes 3D Memory to New Heights with Sixth-generation V-NAND SSDs for Client Computing
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung wins 46 CES 2020 Innovation Awards for Outstanding Design and Engineering
    The future of NAND technology
    How Will 5G Impact on Memory?
    Inside the building blocks of the 5G future
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