Molex HSAutoLink I Interconnect System
Molex HSAutoLink I Interconnect System is available in 4 and 5 circuits and delivers data rates up to 2Gbps. The dependable HSAutoLink Interconnect System brings a proven, USCAR-30 compliant solution for point-to-point in-vehicle connections, complete with multiple keying options and full-length cable shielding for superior signal performance and reduced Electro-Magnetic Interference (EMI)
Features
Data rates up to 2.0 Gbps in 4 and 5 Circuit ConnectorsSupports multiple protocols in the same connector (USB 2.0, LVDS, Ethernet, APIX, etc.)Fully protected shield caseRear side of right-angle header includes closed shield for robustness, signal integrity, and EMI protectionHeaders manufactured from high-temperature plastic materialCompatible with lead-free through-hole reflow process (Pin-in-Paste) or lead-free selective wave soldering process. Meets Jedec 260°C peak temperatureFull-length cable shieldingProvides superior signal performance and reduced electromagnetic interference (EMI)Compact, low-profile systemOptimizes device-side space savings to meet future needs for increasing high-speed communication linksMultiple polarizations and color-coding available10 polarizations and colored headers available for either end of the cable assembly. Ensures correct assembly and provides versatility
Applications
Automotive and Commercial VehiclesInfotainmentTelematicsNavigation SystemsConnected Vehicle ServicesDiagnostics and Data UploadCamera to ControllerController to Display
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