Laird Thermal Systems Tunnel Series Thermoelectric Assemblies (TEAs)
Laird Tunnel Series Thermoelectric Assemblies (TEAs) offer a patented high-performance cross-flow technology that maximizes heat transfer when pulling air through a heat exchanger. These thermoelectric assemblies minimize the number of airflow paths required to operate when compared to traditional impingement flow TEAs. The Tunnel series TEAs are available in two heat transfer mechanism configurations.
Applications
Analytical instrumentationSemiconductor fabricationPhotonics laser systemsIndustrial instrumentationSemiconductor fabricationFood and beverage coolingMedical diagnostic chamber refrigeration
Laird thermal systems Newest
Laird Thermal Systems Tflex HD80000 Thermal Gap Filler combines 6W/mK thermal conductivity with superior pressure vs. deflection characteristics.
Date: 2019-04-05Laird PowerCool Direct-to-Air Thermoelectric Assemblies control temperatures in small chambers used in medical diagnostics or sample storage compartments in analytical instrumentation.
Date: 2018-11-26Laird SuperCool Series Thermoelectric Assemblies are designed to temperature control small chambers used in medical diagnostics or sample storage compartments in analytical instrumentation.
Date: 2018-10-02Laird Thermal Systems HiTemp ET Peltier Thermoelectric Modules are designed to protect critical electronic devices like CMOS sensors in high-temperature applications.
Date: 2018-04-03Laird Air-to-Air Tunnel (AAT) Series Thermoelectric Assemblies (TEAs) offer a reliable and compact performance by cooling objects through convection.
Date: 2017-10-18Laird Direct-to-Air Tunnel (DAT) Series Thermoelectric Assemblies (TEAs) offer a reliable and compact performance by cooling objects through conduction.
Date: 2017-10-17Laird Tunnel Series Thermoelectric Assemblies (TEA) are designed with patented cross flow technology for reliable high-performance.
Date: 2017-09-10