Imaxe | CLAVE N.º de parte / Fabricante | Descrición / PDF | Cantidade / RFQ |
---|---|---|---|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.038. |
291706unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECTANGULAR TO220. Heat Sinks Mounting Pad for TO-220, Rectangular, Nylon, Natural, 13.21mm |
45158unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.125. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 3.18x8.89mm |
192509unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.021. Heat Sinks Semiconductor Mounting Pad for TO-5, 3 Leads, 0.53mm Thickness |
195323unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 1.91x8.64x6.60mm |
103246unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.125. |
305027unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.045. |
808309unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Semiconductor Mounting Pad for TO-5, DAP, Diameter 9.02mm |
131497unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. |
826891unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-5, TO-18, Circular, Dialyl Phthalate (DAP), Black, 3.05x6.35mm |
137521unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.021. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 0.53x8.89mm |
247410unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECT CRYST CAN REL 0.050. Heat Sinks Semiconductor Mounting Pad for Chrystal Can Relay, 1.27mm Thickness |
247410unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.050. |
413445unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.91x9.53mm |
118650unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 1.9x8.71mm |
173508unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.120. Heat Sinks Semiconductor Mounting Pad for TO-18, Circular, Dialyl Phthalate (DAP), 3.05x8.71mm |
290438unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. |
149298unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR 0.040. Thermal Interface Products Insulator, Circular, Beryllium Oxide Ceramic, 1.02x11.94x5.97mm |
20101unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Semiconductor Mounting Pad for TO-18, Nylon, 6.10mm OD, 4.57mm Thickness |
155414unidades de stock |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, 3-4 Leads, 1.91mm Thickness |
217491unidades de stock |